| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve accuracy in a grid structure and uniform periods thereof of a light-emitting diode package, by forming the grid structure to be formed on a fluorescent layer using an ink-jet system, thereby simplifying a manufacturing process. <P>SOLUTION: A manufacturing method of the invention of the LED package includes steps of: preparing an LED chip; forming the fluorescent layer on the LED chip; and forming the fluorescent grid structure in an ink-jet processing which uses an ink with fluorescent powder contained therein, on the fluorescent layer. The manufacturing method of another embodiment of the LED package includes steps of forming the fluorescent layer with a predetermined thickness; forming the fluorescent grid structure in the ink-jet processing which uses an ink with the fluorescent powder contained therein, on the fluorescent layer; and arranging the fluorescent layer on which the fluorescent grid structure has been formed, on the LED chip. <P>COPYRIGHT: (C)2008,JPO&INPIT |
