发明名称 PLATED MATERIAL AND METHOD FOR PREPARATION THEREOF, AND ELECTRIC AND ELECTRONIC PARTS USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a plated material having both high heat-resistance and good insertability/extractability. SOLUTION: The plated material comprises an undercoating layer 2 consisting of any one of metals belonging to group 4, group 5, group 6, group 7, group 8 or group 9 of the periodic table or an alloy containing any one of those metals as a main component, an intermediate coating layer 3 of Cu or a Cu alloy, and a top-coating layer of Sn or an Sn alloy in this order. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008223143(A) 申请公布日期 2008.09.25
申请号 JP20080115871 申请日期 2008.04.25
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 TANAKA HITOSHI;MATSUDA AKIRA;SUZUKI SATOSHI;TANIMOTO MORIMASA
分类号 C25D5/12;C23C26/00;C23C28/02;H01R13/03 主分类号 C25D5/12
代理机构 代理人
主权项
地址