| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device for making satisfactory the electrical connection of a semiconductor chip and a substrate on which the semiconductor chip is mounted. SOLUTION: This semiconductor device is provided with: a semiconductor chip; a protruding electrode installed on the semiconductor chip; and a substrate equipped with a terminal electrode to which the protruding electrode is electrically connected, and a first layer configured of conductive adhesive containing metallic particles and resin materials and a second layer containing low fusing point metal forming metal and alloy configuring the surface of the contact protruding electrode or the contact terminal electrode with a fusing point which is lower than that of the metallic particles are formed between the protruding electrode and the terminal electrode. COPYRIGHT: (C)2008,JPO&INPIT
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