| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in mounting reliability, which has a bump structure capable of preventing deterioration in electric characteristics while having sufficient height in face-down mounting and maintaining sufficient strength in mounting. SOLUTION: The semiconductor device 1 is provided with a semiconductor substrate 2 having an electrode 3 disposed on one surface thereof; a first electronic component 6 disposed on the one surface of the semiconductor substrate 2 and electrically connected to the electrode 3; and a plurality of structures 8 disposed around the first electronic component on one surface side of the semiconductor substrate 2. The structures 8 each consist of a resin post 9 and a solder bump 11 formed on the top of the resin post 9, and gaps S are formed between the structures 8 and the first electronic component 6. The semiconductor device 1 is provided with a second electronic component 14 disposed on the other surface side of the semiconductor substrate 2, and through electrodes 16 formed so as to pierce the semiconductor substrate 2 on a portion having the gap S or a portion opposite to the gaps S with the resin post 9 sandwiched. The first electronic component 6 and the second electronic component 14 are electrically connected to each other via the through electrodes 16. COPYRIGHT: (C)2008,JPO&INPIT
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