| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting apparatus wherein whether the mounting state of a semiconductor chip mounted to a substrate is proper or not can be decided surely. SOLUTION: The mounting apparatus has a mounting tool 7 for joining bumps 4a of a semiconductor chip 4 to a substrate 1 by applying supersonic vibration to the bumps and the substrate while pressing the bumps to the substrate so as to mount the semiconductor chip to the substrate, an infrared camera 33 for photographing via the semiconductor chip the bumps of the semiconductor chip mounted to the substrate, and further, an image processing portion 34 for image-processing the photographing signal of the infrared camera, and a comparing portion 37 for searching the crushing extent of the bumps from the photographing signal processed in the image processing portion so as to determine the performed mounting state of the semiconductor chip by the bumps. COPYRIGHT: (C)2008,JPO&INPIT
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