| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film having improved thermal shrinkability and simultaneously having improved adhesiveness. SOLUTION: This polyimide film comprising (1) a polyimide obtained from 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, and pyromellitic dianhydride, and (2) inorganic particles having particle diameters of 0.01 to 1.5μm and an average particle diameter of 0.05 to 0.7μm in an amount of 0.1 to 0.9 wt.% based on the weight of the polyamic acid is characterized by having a surface free energy of≥80 mN/m, when the polyimide film is sequentially subjected to a discharge treatment and a heating treatment in a state constantly keeping the longitudinal tension of the film and then measured on the basis of a contact angle method, and further having a thermal shrinkage degree of≤0.10% at 200°C for one hour. COPYRIGHT: (C)2008,JPO&INPIT
|
