| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film having improved thermal shrinkability and improved adhesiveness, and to provide a method for producing the same. SOLUTION: This polyimide film comprising (1) a polyimide obtained from 4,4'-diaminodiphenyl ether and pyromellitic dianhydride and (2) inorganic particles having particle diameters of 0.01 to 1.5μm and an average particle diameter of 0.05 to 0.7μm in an amount of 0.1 to 0.9 wt.% based on the weight of the polyamic acid is characterized by having a surface free energy of≥80 mN/m, when the polyimide film is sequentially subjected to a heating treatment and a discharge treatment in a state constantly keeping the longitudinal tension of the film and then measured on the basis of a contact angle method, and further having a thermal shrinkage degree of≤0.10% at 200°C for one hour. The present invention further includes a method for producing the polyimide film. COPYRIGHT: (C)2008,JPO&INPIT
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