发明名称 METHOD FOR MANUFACTURING MEMS STRUCTURE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To realize a manufacturing technique for efficiently manufacturing a MEMS (Micro Electro Mechanical System) structure. SOLUTION: This MEMS structure is provided with processes of: forming an insulating film 11 on a substrate 10; forming MEMS function structure parts 12, 14, 15A, 15B, 16A and 16B on the insulating film 11; forming a sidewall 18S on a side surface at an edge part of each of the MEMS function structure parts and removing the insulating film 11 by leaving parts coated with the MEMS function structure parts and the sidewall; and removing the sidewall 18S. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008221394(A) 申请公布日期 2008.09.25
申请号 JP20070062979 申请日期 2007.03.13
申请人 SEIKO EPSON CORP 发明人 MORI TAKASHI;SATO AKIRA
分类号 B81C1/00 主分类号 B81C1/00
代理机构 代理人
主权项
地址