DEVICE AND METHOD FOR PRETREATING ELECTRONIC COMPONENTS PRIOR TO SOLDERING

摘要

A device and method are provided for reflow soldering workpieces wherein a plasma device for an atmospheric plasma treatment of the workpiece is upstream of a solder application and/or upstream of a soldering zone, and wherein the method subjects the workpiece to an atmospheric plasma treatment with the aid of a plasma device prior to the application of the solder and/or prior to the soldering process.