METHOD AND DEVICE FOR THE INSPECTION OF DEFECTS ON THE EDGE REGION OF A WAFER AND USE OF SAID DEVICE IN AN INSPECTION DEVICE FOR WAFERS

摘要

The invention relates to a device, method, and use for the inspection of defects on the edge region of a wafer (6). At least one illumination device (41) illuminates the edge region (6a) of the wafer (6). At least one optical unit (40) is provided, said unit being positionable as a function of the position of the defect (88) relative to a top surface (30) of the wafer edge (6a) or a bottom surface (31) of the wafer edge (6a) or a face (32) of the wafer edge (6a) for capturing an image of said defect.