| 摘要 |
<p>A semiconductor chip package having reduced coupling noise is provided to electrically block a signal wiring which connects a signal pad of the semiconductor chip with a signal terminal of the lead frame by an extended ground wiring. A semiconductor chip package having reduced coupling noise includes a lead frame, a semiconductor chip(305), a signal wiring(323), and a ground wiring(325). The lead frame includes a die pad(301), a grounding terminal(302) extended on the side of the die pad, and a signal terminal(315) which is separated from the die pad. The semiconductor chip is mounted on the die pad and has a signal pad(307) and a ground pad(309). The signal wiring connects the signal pad and the signal terminal. The ground wiring connects the ground pad and the ground terminal. The ground wiring is located near the signal wiring, but not connected to the signal wiring. The length of the ground wiring is the same or greater than that of the signal wiring. The overlapping length between the ground wiring and the signal wiring is the same as the signal wiring.</p> |
