| 摘要 |
A radiation-sensitive resin composition is provided to exhibit high radiation sensitivity, and to have a development margin capable of forming a good pattern profile even when a development treatment is performed after an optimal development time is exceeded. A radiation-sensitive resin composition contains [A] a copolymer of (a1) an unsaturated compound having a carboxyl group represented by the following formula 1, (a2) an unsaturated compound having a heterocyclic epoxy skeleton selected from the formulae (2-1) to (2-3), and (a3) at least one unsaturated compound selected from the group comprising methacrylic acid alkylester, methacrylic acid cyclic alkylester, methacrylic acid cyclic alkylester, methacrylic acid ester having a hydroxyl group, acrylic acid cyclic alkylester, methacrylic acid arylester, acrylic acid arylester, unsaturated dicarboxylic acid diester, bicyclo unsaturated compounds, maleimide compounds, unsaturated aromatic compounds, conjugated dienes, unsaturated compounds having a tetrahydrofuran skeleton, a furan skeleton, a tetrahydropyran skeleton, a pyran skeleton, a glycidyl skeleton, or a skeleton represented by the following formula 3, unsaturated compounds containing a phenolic hydroxyl group represented by the following formula 4, acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, and vinylacetate, and [B] a 1,2-quinonediazide compound. |
