| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting element array chip having a wire bonding pad for achieving a high brilliance printer exposure light source. <P>SOLUTION: The light-emitting element array chip consisting of a plurality of light-emitting elements arranged two-dimensionally on a substrate has a shape of parallelogram where each long side and each short side make an acute angle or an obtuse angle each other. One segment is formed by arranging a plurality of rows of a plurality of light-emitting elements connected with one common electrode in the long side direction, and arranging a plurality of rows of a plurality of light-emitting elements in the short side direction, one block is formed by arranging a plurality of segments along the long side direction, and a light-emitting element array is formed by arranging a plurality of blocks along the long side direction. An electrode pad corresponding to a block at the end of the light-emitting element array chip is provided on the long side of a part where the long and short sides defining the shape of the light-emitting element array chip are making an acute angle. <P>COPYRIGHT: (C)2008,JPO&INPIT |
