发明名称 DOUBLE-SIDE MACHINING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To improve the machining accuracies of the upper and lower machining surfaces of a work by uniformly supplying a slurry to the upper and lower machining surfaces of the work, and by uniforming the machining accuracy of the lower surface of the work in the radial direction. <P>SOLUTION: This double-side machining device 1 comprises: a lower platen 30 holding a work 250 to be machined on both sides and disposed under a carrier 200 revolving while rotating on a track and having a polishing surface 31 for polishing the lower surface of the work 250; and an upper platen 50 disposed opposite the lower platen 30, having a polishing surface 51 for polishing the upper surface of the work 250 held by the carrier 200, and having a slurry feed hole 52 for feeding the slurry to the work 250. A slurry discharge hole 34 for discharging the slurry supplied toward the work 250 is formed in the lower platen 30. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008221355(A) 申请公布日期 2008.09.25
申请号 JP20070059567 申请日期 2007.03.09
申请人 EPSON TOYOCOM CORP 发明人 YUKI HIROAKI
分类号 B24B37/00;B24B57/02 主分类号 B24B37/00
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