| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor-sealing epoxy resin composition good in flowability when molding, mold-release characteristics, and continuous moldability, and having excellent characteristics in soldering resistance. <P>SOLUTION: The semiconductor-sealing epoxy resin composition comprises: (A) an epoxy resin containing a specific biphenyl type epoxy resin (a1) and/or a specific bisphenol type epoxy resin (a2); (B) a phenol resin-based curing agent; (C) an organopolysiloxane having a carboxyl group (c1) and/or a reaction product (c2) of the organopolysiloxane having a carboxyl group (c1) and an epoxy resin; and (D) pentaerythritol tetra-fatty acid ester (d1) and/or dipentaerythritol hexa-fatty acid ester (d2). <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
