| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure for preventing an impact on the performance of an element as a result of the contraction of a conductive portion in a manufacturing process for the element, the structure preventing the contraction of the conductive portion in a small area. SOLUTION: The structure includes the conductive portion 100 of a semiconductor element, an extension portion 110 formed by extending part of the conductive portion 100, and a shield portion 120 formed to be integral with the extension portion 110. In this configuration, the effect of the contraction of an outer peripheral part, which is likely to be exerted on the conductive portion, is received by the shield portion 120 to prevent the contraction of the conductive portion. The shield portion is smaller than the conductive portion, thus it does not hamper size reduction. The shape of the shield portion can be selected freely, so that the above structure can apply to a semiconductor having a complicated outer peripheral shape. COPYRIGHT: (C)2008,JPO&INPIT
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