| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for a radiation-curable adhesive that can readily bond a molded item of a PVA resin to an adherend and form a composite (such as laminated film and the like) excellent in cutting resistance, moist heat resistance, adhesive strength and the like. SOLUTION: The composition comprises (A) an alicyclic epoxy compound, (B) a compound having a number-average molecular weight of at least 500 represented by formula (1): HO-(R<SP>1</SP>-O-CO-O)<SB>m</SB>-(R<SP>2</SP>-O-CO-O)<SB>n</SB>-R<SP>3</SP>-OH (1) (wherein R<SP>1</SP>and R<SP>2</SP>are each independently a bivalent 2-12C hydrocarbon group; R<SP>3</SP>is the same structure as either one of R<SP>1</SP>and R<SP>2</SP>; m is 2-150; n is 0-150; and m+n is 2-200), and (C) a photoacid-generating agent. The composite 1 is obtained by laminating an adherend 3 on one surface of the PVA molded item 2 via an adhesive layer 4 composed of a cured product of the composition for the radiation-curable adhesive. COPYRIGHT: (C)2008,JPO&INPIT
|
