| 摘要 |
An exposure method of a semiconductor device includes the steps of: providing a wafer on which a photoresist is coated; rotating and aligning a reticle and the wafer so that a swing direction of a light source passing through the reticle is identical to a direction of a word line formed on the wafer; and performing an exposure process employing a polarized light source of an X direction, the polarized light source being generated by passing the light source through a dipole X-illumination system
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