CAMERA MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A camera module package and a method of manufacturing the camera module package are provided to laminate a silicon wafer on a flexible circuit board and cover the silicon wafer with a lens unit in the form of a thin film to produce an ultra-thin camera module package. A camera module package includes a silicon wafer(110) on which an image sensor(140) is mounted, a lens unit(120), and a flexible circuit board(130). The silicon wafer has pads(150) placed at both sides of the image sensor. The lens unit covers the surface of the wafer such that a convex lens(121) is formed on the image sensor. The flexible circuit board is attached to the bottom face of the wafer and electrically connected to the pads through an internal pattern thereof. An IR filter layer is on the center of the lens.