| 摘要 |
An LED package which employs a high temperature plastic or polymeric material which is compatible with gold-tin eutectic solder and which can replace the higher cost ceramic used in conventional LED packages. The novel LED package has a high thermal conductivity substrate, a high reflectivity for visible light and/or W light, and good aging properties. The high temperature material is a high temperature liquid crystal polymer having a melting temperature greater than about 340°C and has small filler particles near the surface, the particles having a refractive index greater than about 2.0, and a size range of about 0.2 to 0.3 microns. For an LED package which is reflective to W light, a W stabilizer can be included in the plastic material to improve reflectivity in the ultraviolet spectrum and to protect from W degradation of the plastic material which can be caused by W light emitted by some LEDs. |
