发明名称 |
CONDUCTION LINE PATH STRUCTURE, ITS PRODUCTION METHOD, AND WIRING SUBSTRATE |
摘要 |
<P>PROBLEM TO BE SOLVED: To achieve stable transmission characteristics to an extremely high signal frequency (for example, several hundred GHz or higher) by easily adjusting the characteristic impedance of a conduction line path by dramatically improving the resistance of a conduction line path structure to a signal crosstalk between wirings and an external noise. <P>SOLUTION: Provided are a conduction line path structure comprising on a substrate a signal line and a conduction shield layer formed so as to be isolated via an insulating layer, with the insulating layer formed partially or totally with an electrodeposition organic thin film, and a wiring substrate comprising the conduction line path structure. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008227147(A) |
申请公布日期 |
2008.09.25 |
申请号 |
JP20070063307 |
申请日期 |
2007.03.13 |
申请人 |
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY |
发明人 |
YOKOSHIMA TOKIHIKO;NAKAGAWA HIROSHI;AOYANAGI MASAHIRO;KIKUCHI KATSUYA |
分类号 |
H05K1/02;H01P3/06;H01P3/08;H05K9/00 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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