| 摘要 |
PROBLEM TO BE SOLVED: To provide a release sheet for semiconductor sealing excellent in facility for releasing from a metallic mold or an IC mounted substrate, having high strength and high degree of elongation. SOLUTION: The release sheet for semiconductor sealing is characterized by comprising thermosetting resin composition containing one or more of each of (a) acrylic resin, (b) epoxy resin, (c) epoxy resin curing agent, (d) release agent, and (e) inorganic filler. COPYRIGHT: (C)2008,JPO&INPIT
|
