发明名称 CONNECTION APPARATUS FOR PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a connection apparatus for a printed wiring board which apparatus prevents a short-circuit accident and meets a demand for high-density configuration. SOLUTION: According to the connection apparatus for the printed wiring board, a projected portion 2a of a subboard 2 is fitted into a slit 4 of a main board 1, and each of subboard side pads Pa is butted against each of main board side pads Pb across a boundary line K between the projected portion 2a and the main board 1. As a result, a plurality of twin pads P are formed at given intervals along the boundary line K, where each twin pad P is soldered. The subboard side pads Pa and main board side pads Pb are formed into trapezoid pads each having one side edge and another side edge parallel to each other. Out of the parallel side edges of the trapezoid pads Pa and Pb, side edges smaller in width are butted against each other to form the twin pads P, wherein the width h1 of the center of the space 3 is determined to be greater than the width h2 between both ends of adjacent twin pads P. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008226964(A) 申请公布日期 2008.09.25
申请号 JP20070059810 申请日期 2007.03.09
申请人 FUNAI ELECTRIC CO LTD 发明人 HITONISHI ATSUSHI
分类号 H05K1/14;H05K1/11 主分类号 H05K1/14
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