SILICONE RESIN COMPOSITION FOR ENCAPSULATING LUMINESCENT ELEMENT AND PROCESS FOR PRODUCING OPTICAL-SEMICONDUCTOR ELECTRONIC PART WITH THE SAME THROUGH POTTING

摘要

A silicone resin composition for luminescent-element encapsulation with which encapsulation by potting is easy and which can be easily molded into a lens shape (e.g., a hemispherical or parabolic shape). The encapsulant lens formed by potting can have high transparency. The silicone resin composition for encapsulating luminescent elements contains silica having an average particle diameter of 1-30 nm in an amount of 2-25 wt.% based on the total amount of (A) and (B). The composition has a viscosity (23°C) of 10-70 Pa S, excluding 10 Pa S and 70 Pa S, and a thixotropic index of 2.0-5.5 and is for use in encapsulation by potting. Also provided is a process for producing an optical-semiconductor electronic part, characterized in that the composition is applied as an encapsulating resin to a substrate having a luminescent element to mold the encapsulating resin into a lens shape by potting.