A method for manufacturing an inkjet print head is provided to increase the productivity by adopting wet etching and achieve a structure improved in miniaturization and strength. A method for manufacturing an inkjet print head comprises the steps of preparing a silicon wafer having an azimuth of 110 as a substrate(10); forming a trench(50) on the front surface(10a) of the substrate; and forming an ink supply port(40) from the rear surface of the substrate to the trench through a wet etching process so that the inner wall of the ink supply port is vertical. Etchant used for the wet etching process includes at least one selected from the group consisting of KOH, NaOH and TMAH.
申请公布号
KR20080086306(A)
申请公布日期
2008.09.25
申请号
KR20070028322
申请日期
2007.03.22
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
LEE, JIN WOOK;KIM, KYONG IL;PARK, SUNG JOON;KIM, IL WOO