发明名称 PLASMA SPECIES AND UNIFORMITY CONTROL THROUGH PULSED VHF OPERATION
摘要 An apparatus for controlling plasma species and plasma uniformity through a pulsed VHF(Very High Frequency) operation is provided to improve substrate treatment uniformity by maintaining process parameters in a process chamber constant. A process treating apparatus includes a chamber, a high frequency power source(116), and a low frequency power source(118). The chamber includes first and second electrodes allocated therein. The high frequency power source is electrically connected to one of the first and second electrodes and provides a first RF(Radio Frequency) signal to the connected electrode. The low frequency power source is connected to one of the first and second electrodes and provides a second RF signal to the connected electrode. A frequency range of the high frequency power source is arranged between 27 and 200 MHz. A duty cycle of a pulse lies between 1% and 100%.
申请公布号 KR20080086373(A) 申请公布日期 2008.09.25
申请号 KR20080025793 申请日期 2008.03.20
申请人 APPLIED MATERIALS INC. 发明人 PATERSON ALEXANDER;PANAGOPOULOS THEODOROS;TODOROV VALENTIN N.;HATCHER BRIAN K.;KATZ DAN.;HAMMOND IV EDWARD P.;HOLLAND JOHN P.
分类号 H05H1/24;H05H1/36;H05H1/46 主分类号 H05H1/24
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