| 摘要 |
<p>A semiconductor package for optical detection is provided to greatly improve reliability of products and minimize generation of defects by basically removing the defects like contamination of a package substrate of a light transmitting material. A light transmission part in which visible light can partially transmit is formed in a first substrate(500). A conductive layer(515) is formed on the first substrate, including a first conductive part for receiving an optical signal transferred from the outside and a second conductive part for transferring the received optical signal to the outside. The conductive layer is protected by an insulation layer(510). A transparent window(600) can be bonded to one surface of the first substrate to cover the light transmission part. An infrared filter can be coated on the surface of the transparent window.</p> |
