| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a Cu alloy interconnecting film, not only for which low electric resistivity Cu can be used as interconnecting material, but also where risk of peeling is eliminated, because of high adhesiveness to glass substrate, TFT element for flat panel display manufactured using its Cu alloy interconnecting film, and Cu-alloy sputtering target used for manufacturing the Cu alloy interconnecting film. <P>SOLUTION: An interconnecting film 2, constituting a TFT element 1 for the flat panel display and sputtering target for manufacturing the film, are such that they consist mainly of Cu, and contain at least one kind among Pt, Ir, Pd, and Sm by the amount of 0.01-0.5 atom%, and in that the interconnecting film 2 is laminated on a glass substrate 3; furthermore, a transparent conductive film 5 is laminated on it via an insulating film 4. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
