发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of suppress deterioration of through put even when a substrate is required to be alternated between two chambers, and capable of downsizing an apparatus. <P>SOLUTION: In a substrate processing apparatus 1, since both a first chamber 11 and a second chamber 12 have a flat surface of regular octagon, a wide space exists at a place sandwitched between sides 11a and 12a and a place sandwitched between sides 11c and 12c between the first chamber 11 and the second chamber 12 when sides 11b and 12b are opposed to each other. Therefore, a first connection room 30 is arranged so as to be adjacent to the sides 11a and 12a, and a second connection room 40 is arranged so as to be adjacent to the sides 11c and 12c. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008166656(A) 申请公布日期 2008.07.17
申请号 JP20070000433 申请日期 2007.01.05
申请人 SEIKO EPSON CORP 发明人 MIYAZAWA HIDEAKI
分类号 H01L21/67;H01L21/02 主分类号 H01L21/67
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