| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning method capable of improving the cleanliness in an object to be cleaned. SOLUTION: While a wafer W is being placed in an inner tank 11 of a cleaning tank 10, a supply device 15 supplies a cleaning liquid to the inner tank 11, the entire wafer W placed in a carrier 20 is dipped into the cleaning liquid, and an entire nozzle 33 of an ultrasonic shower 30 is dipped into the cleaning liquid. Then, a supply device 36 supplies the cleaning liquid to the ultrasonic shower 30, the ultrasonic shower 30 vibrates the cleaning liquid supplied by an internal ultrasonic vibrator 32, and the vibrated cleaning liquid is injected into the cleaning liquid accumulated in the inner tank 11 via the nozzle 33. Furthermore, a discharge device 16 discharges the cleaning liquid in the inner tank 11 during cleaning liquid spray from the ultrasonic shower 30. COPYRIGHT: (C)2008,JPO&INPIT
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