发明名称 INJECTION MOLDING MOLD
摘要 PROBLEM TO BE SOLVED: To continuously mold resin molded products having undercut portions inside of the products. SOLUTION: A pair of slide cores 6 is arranged in movable-side mold plates 4 so as to slide on a movable-side receiving plate 5 and cavity blocks 7 are connected to the cores. In a pair of facing inner slide cores 11, supporting portions 11a are incorporated in a fixed-side mold plate 2 movably in a mold opening and closing direction and in a vertical direction, tips face a cavity 8 having bosses 11b fitting into undercut portions 9a of the molded product 9 formed inside the molded product 9. A center core 12 having a tapering portion is secured to the fixed-side receiving plate 3 and the tip enters the inside of an inner slide core 11 so as to be sandwiched. Pushing pins 13 arranged in the cavity blocks 7 are biased by coil springs 14 and push and press the inner slide core 11 in a closing direction. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008162213(A) 申请公布日期 2008.07.17
申请号 JP20060356871 申请日期 2006.12.29
申请人 CITIZEN ELECTRONICS CO LTD 发明人 SHIMURA KOJI
分类号 B29C45/44;B29C33/44 主分类号 B29C45/44
代理机构 代理人
主权项
地址
您可能感兴趣的专利