| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a joining material and a joining process that can achieve low-temperature joining during the joining stage in a mounting process, and to provide a semiconductor package in which no long term reliability is impaired even under a high temperature environment. <P>SOLUTION: In a joining material using metallic particles whose average grain size coated with an organic matter is≤100μm, the joining material is characterized in that one or more peaks are possessed in a grain-size distribution in the volume criterium of≤100 nm and≤100 nm-100μm respectively and that the carbon number of the organic component coating the metallic particles is 2-8. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
