发明名称 MOUNTING SUBSTRATE, HEIGHT ADJUSTMENT DEVICE, AND MOUNTING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a mounting substrate having a configuration capable of easily adjusting and raising the height of a thermofusion joint member in a state where the thermofusion member is fused without arranging an extra component in an electronic component, and to provide a height adjustment device, and a mounting method. <P>SOLUTION: The electronic component 1 where a mounting terminal 5 is made of the thermofusion member is mounted on the mounting substrate 6. The mounting substrate 6 has a screw hole 13 penetrating the substrate in a mounting region. A screw 12 is screwed into the screw hole 13. The screw 12 is screwed, so as to be abutted onto the lower surface of the electronic component 1 in a process for heating and fusing the thermofusion joint member, as a height adjustment member for keeping a prescribed distance between the electronic component 1 and the mounting substrate 6. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008166411(A) 申请公布日期 2008.07.17
申请号 JP20060352747 申请日期 2006.12.27
申请人 FUJITSU LTD 发明人 SO TAKESHI;UZUKA YOSHINORI;AIZAWA OSAMU;KUBO HIDEO
分类号 H05K1/18;H01L21/60 主分类号 H05K1/18
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