发明名称 Semiconductor Device And Method Of Manufacturing Such A Device
摘要 The invention relates to a semiconductor device ( 10 ) with a semiconductor body ( 1 ) comprising a high-ohmic semiconductor substrate ( 2 ) which is covered with a dielectric layer ( 3 ) containing charges, on which dielectric layer one or more passive electronic components ( 4 ) comprising conductor tracks ( 4 ) are present, and at the location of the passive elements ( 4 ) a semiconductor region ( 5 ) is present at the interface between the semiconductor substrate ( 2 ) and the dielectric layer ( 3, 4 ), a first conductivity-type conducting channel induced in the semiconductor substrate ( 2 ) by the charges being interrupted by, and at the location of, the semiconductor region ( 5 ). According to the invention, the semiconductor region ( 5 ) is monocrystalline and of a second conductivity type, opposite to the first conductivity type. In this way the charge of an induced channel is locally compensated by the charge of the semiconductor regions ( 5 ). The device ( 10 ) has a very low high-frequency power loss, because the inversion channel is interrupted at the location of the semiconductor region ( 5 ). The device ( 10 ) further allows for a higher thermal budget and thus for the integration of active semiconductor elements ( 8 ) into the semiconductor body ( 1 ). Preferably, the semiconductor region ( 5 ) comprises a large number of strip-shaped sub-regions ( 5 A, 5 B, 5 C).
申请公布号 US2008169527(A1) 申请公布日期 2008.07.17
申请号 US20050568196 申请日期 2005.04.12
申请人 KONINKLIJKE PHILIPS ELECTRONICS 发明人 VAN NOORT WIBO DANIEL
分类号 H01L29/00;H01L21/02;H01L21/761;H01L27/08;H01L29/06 主分类号 H01L29/00
代理机构 代理人
主权项
地址