| 摘要 |
<p>A conductive composition for coating a semiconductor wafer comprises conductive filler that has an average particle size of less than 2 microns and a maximum particle size of less than 10 microns, a first resin that has a softening point between 80-260°C, solvent, curing agent, and a second resin, wherein at room temperature the first resin is substantially soluble in the solvent.</p> |
