| 摘要 |
A multilayer printed circuit board or a substrate on which a semiconductor element is mounted, wherein, on a resin-insulating layer that houses the semiconductor element, another resin-insulating layer and a conductor circuit have been formed sequentially with an electrical connection through a via hole between said semiconductor element and conductor circuit, wherein said semiconductor element is housed in a concave portion provided on the resin-insulating layer, and a metal layer, on which said semiconductor element is placed, is formed on the bottom of the concave portion; or a substrate on which the semiconductor element is mounted. As a result, a multilayer printed circuit board can be obtained on which an embedded semiconductor element is electrically connected through a via hole. |
