发明名称 |
METHOD OF DEPOSITING RUTHENIUM FILM USING RUTHENIUM TETROXIDE |
摘要 |
A method for depositing a ruthenium layer using R2O4 is provided to form rapidly the ruthenium layer having high step coverage on a surface having a large aspect ratio. A loading process is performed to load a substrate into a chemical vapor deposition reactor(100). A first supplying process is performed to supply a ruthenium organic metal compound to the chemical vapor deposition reactor(110). A second supplying process is performed to supply inert gas to the chemical vapor deposition reactor(120). A third supplying process is performed to supply R2O4 to the chemical vapor deposition reactor(130). A fourth supplying process is performed to supply the inert gas to the chemical vapor deposition reactor(140).
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申请公布号 |
KR20080066619(A) |
申请公布日期 |
2008.07.16 |
申请号 |
KR20080003647 |
申请日期 |
2008.01.11 |
申请人 |
ASM GENITECH KOREA LTD. |
发明人 |
LEE, CHUN SOO;KOH, WON YONG |
分类号 |
H01L21/20;H01L21/02;H01L21/205 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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