发明名称 METHOD OF DEPOSITING RUTHENIUM FILM USING RUTHENIUM TETROXIDE
摘要 A method for depositing a ruthenium layer using R2O4 is provided to form rapidly the ruthenium layer having high step coverage on a surface having a large aspect ratio. A loading process is performed to load a substrate into a chemical vapor deposition reactor(100). A first supplying process is performed to supply a ruthenium organic metal compound to the chemical vapor deposition reactor(110). A second supplying process is performed to supply inert gas to the chemical vapor deposition reactor(120). A third supplying process is performed to supply R2O4 to the chemical vapor deposition reactor(130). A fourth supplying process is performed to supply the inert gas to the chemical vapor deposition reactor(140).
申请公布号 KR20080066619(A) 申请公布日期 2008.07.16
申请号 KR20080003647 申请日期 2008.01.11
申请人 ASM GENITECH KOREA LTD. 发明人 LEE, CHUN SOO;KOH, WON YONG
分类号 H01L21/20;H01L21/02;H01L21/205 主分类号 H01L21/20
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