发明名称 IN-LINE TYPE SPUTTER
摘要 An in-line sputtering apparatus is provided to form a uniform coating film on deposition objects with various shapes and appearances by rotating deposition objects treated in the in-line sputtering apparatus in the sputtering process. An in-line sputtering apparatus comprises: a carrier(1) for moving deposition objects inside and outside the in-line sputtering apparatus; a plurality of mounting holders(31) which are installed in the carrier, and on which the deposition objects are mounted; and holder rotating units for rotating the mounting holders. The mounting holders are installed inside the carrier, and the holder rotating units rotate the mounting holders at almost same speed. The holder rotating units comprise: power supply parts that supply a power for rotating the mounting holders; and power transmission parts for connecting the power supply parts and the mounting holders, and transmitting rotary power supplied from the power supply parts to the mounting holders. The in-line sputtering apparatus further comprises a rotary shaft installation frame(2) which is laterally installed in a central inner part of the carrier, and in which a rotary shaft(21) is axially installed, and a plurality of deposition object installation frames(3) symmetrically installed at both side or one side of the rotary shaft installation frame, and apart from one another at a regular interval.
申请公布号 KR20080066633(A) 申请公布日期 2008.07.16
申请号 KR20080024730 申请日期 2008.03.18
申请人 CLC PHYCHEM CO., LTD. 发明人 JUNG, JIN BONG
分类号 C23C14/34;C23C14/56 主分类号 C23C14/34
代理机构 代理人
主权项
地址