发明名称 CONDUCTIVE PASTE COMPOSITION
摘要 PURPOSE: A conductive paste composition is provided to improve productivity due to excellent physical properties, especially, adhesion properties, to reduce alkaline waste water, and to be usefully applied to a gravure offset printing paste by forming improved micro-patterns. CONSTITUTION: A conductive paste composition for forming an electrode comprises: 5-30 weight% of an acrylate binder resin having hydroxyl group which is synthesized from a compound including a monomer with the hydroxyl group, diacrylic monomer, and an initiator; 50-90 weight% of metal fine powder; 1-10 weight% of a glass frit; and 4-30 weight% of solvent having a boiling point of 150-300°C.
申请公布号 KR20100056730(A) 申请公布日期 2010.05.28
申请号 KR20080115685 申请日期 2008.11.20
申请人 SSCP CO., LTD. 发明人 CHO, SEUNG KI;KIM, WHA JOONG;KIM, JOO HO;KIM, HYUN JUN
分类号 H01B1/22;H01J11/22 主分类号 H01B1/22
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