METHOD FOR MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICE

摘要

PURPOSE: A manufacturing method of the flexible semiconductor device transfers film to the domain in which the peeling layer does not dissolve. The generation of the curve stress is prevented. CONSTITUTION: A peeling layer(101) is formed on the substrate(100). The semiconductor device is formed on the peeling layer. The resin layer(103) is formed on the semiconductor device. The peeling layer dissolves by using the etchant(104). The semiconductor device exfoliates from substrate. The resin layer comprises the UV curable acrylate.