| 摘要 |
PURPOSE: A light emitting diode package is provided to improve a property of a package product by increasing current efficiency per unit area. CONSTITUTION: A light emitting diode package includes a lead frame(110), a package mold(120), an LED chip(130), a wire(140), and a molding agent(150). The lead frame is composed of a first lead frame(110a) and a second lead frame(110b). The mold receives a part of a pair of lead frames and is formed to define a molding agent filling space. An LED chip is composed of a first LED chip(130a) and a second LED chip(130b) which are mounted on the upper side of the first lead frame and the second lead frame inside the package mold. A wire is installed to electrically connect a pair of LED chips and lead frames. The molding agent is filled in the package mold and protects the pair of LED chips and the wire.
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