发明名称 MULTI-LAYER LTCC SUBSTRATE AND MANUFACTORING METHOD THEREOF
摘要 PURPOSE: A multi-layer LTCC substrate and a manufacturing method thereof are provided to prevent a shot circuit by forming insulating pattern between a conductive VIA and a conductive pattern. CONSTITUTION: A multiple layers LTCC substrate(100) comprises a first dielectric layer(110a), a second dielectric layer(110b), and a third dielectric layer(110c). The first dielectric layer comprises a first conductive pattern(120) and a first conductive VIA(130). The first conductive VIA is connected to the first conductive pattern. The second dielectric layer is laminated in the lower-part of the first dielectric layer. A second dielectric layer comprises a second conductive pattern(140). The second conductive pattern is connected to the first conductive VIA through the first conductive pattern. A third dielectric layer is formed in the lower-part of the second dielectric layer. A third dielectric layer comprises a third conductive pattern(150). The third conductive pattern comprises a insulating pattern(160).
申请公布号 KR20100024286(A) 申请公布日期 2010.03.05
申请号 KR20080083075 申请日期 2008.08.25
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, JIN WAUN;SUNG, JE HONG
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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