APPARATUS FOR BONDING A DIE

摘要

PURPOSE: An apparatus for bonding a die is provided to selectively bond a die on the upper side and the lower side of a substrate depending on the kinds of the substrate by arranging a first and a second die bonding part on the upper and the lower side of the substrate. CONSTITUTION: A transfer stage(100) transfers a substrate(S) to the horizontal direction. A first die bonding part(400) and a second die bonding part(500) are respectively arranged on the upper side and the lower side of the transfer stage. The fist die bonding part and the second die bonding part selectively bond the substrate on the upper or the lower side of the substrate depending on the kind of the substrate. A first coating part(200) and a second coating part(300) apply an adhesive on the substrate. The first and the second die bonding parts include an absorbing part, a first transfer part and a second transfer part.