| 摘要 |
PURPOSE: A wafer level camera module and a manufacturing method thereof are provided to facilitate focus adjustment between an image sensor and a lens and use a wafer lens with a different focus distance, thereby improving yield. CONSTITUTION: A wafer level camera module and a manufacturing method thereof include a wafer(101), a bonding unit(130), a transparent member(102), a wafer lens(120), and a spacer(121). On the wafer, an image sensor(103) is mounted. The bonding unit is applied so that the height of the bonding unit can be adjusted. The transparent member is welded on the wafer through the bonding unit so that the image sensor is sealed up. The wafer lens is settled on the upper part of the transparent member. The spacer is on the transparent member and wafer lens so that the wafer lens is settled at a fixed interval.
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