发明名称 |
Multilayer ceramic substrate, electronic component, and method of manufacturing multilayer ceramic substrate |
摘要 |
A multilayer ceramic substrate in which an active element and a passive element are surface-equipped over the outermost surface on one side is provided. The multilayer ceramic substrate comprises a plurality of laminated ceramic substrate layers, a surface layer terminal electrode provided in a via hole of an outermost ceramic substrate layer on at least one side and having a surface layer via electrode and a metal plating layer deposited over an end surface of the surface layer via electrode, and a via conductor which connects the surface layer terminal electrode and circuit patterns over the ceramic substrate layer at the inside, wherein a via hole size of a surface layer terminal electrode for connection of the active element is smaller than a via hole size of a surface layer terminal electrode for connection of the passive element. |
申请公布号 |
EP2107863(A1) |
申请公布日期 |
2009.10.07 |
申请号 |
EP20090157079 |
申请日期 |
2009.04.01 |
申请人 |
HITACHI METALS, LTD. |
发明人 |
IKEDA, HATSUO;ICHIKAWA, KOJI |
分类号 |
H05K1/11;H05K3/42 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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