| 摘要 |
A control device as a module comprises a control board 1, a sub-module 2 and a housing cover 3. A microcomputer is mounted on the control board 1. The sub-module 2 has a sub-module case 6 provided with a wiring layer 7 into a wall of the sub-module case 6. Electronic parts 8, 9 are mounted in the sub-module case 6 to electrically connect to the control board 1 through the wiring layer 7. A housing cover 3 accommodates the control board 1 and the sub-module 2. A housing base 4 is joined with the housing cover 3. The accommodation portion 15; 18 has a shape corresponding to a shape of each of the electronic parts 8, 9 is arranged in the housing cover 3. The sub-module 2 is mounted to the housing cover 3 with a heat radiation adhesive 14 between the accommodation portion 15; 18 and each of the electronic parts 8, 9. |
