| 摘要 |
PURPOSE: A wafer processing device including a wafer alignment device is provided to detect and correct the wafer deviation and remove high speed sampling of the pulses from an output signal of the photo sensor or handing device. CONSTITUTION: At least one wafer processing chamber is connected to a wafer handing chamber. A wafer handling device(1) loads a wafer(33) inside the wafer processing chamber. The wafer handling device is positioned inside the wafer handling chamber. At least one first photo sensor(31) is positioned inside the wafer handing chamber in front of the wafer processing chamber. At least one second photo sensor is positioned inside the wafer handling chamber in front of the wafer processing chamber. The wafer handing device includes an end effector for positioning the wafer. |
