| 摘要 |
<p>A lead frame for semiconductor package is provided to attach a lead lock tape in the grooves of an inner lead and a die paddle in order to reduce the thickness of the semiconductor package. A lead frame for semiconductor package comprises a die paddle(206), a plurality of leads(202) and a lead lock tape(220). The die paddle is arranged at some distance. A groove is formed on the lower part of the die paddle. The leads are arranged between die paddles. The groove is formed on the lower part of the lead. The lead lock tape adheres to the grooves of the die paddle and the lead.</p> |
