| 摘要 |
A PCB or package substrate structure comprises a plurality of interleaved metal and dielectric layers (figure 1, not shown) forming a stack and a plurality of micro vias connecting adjacent pairs of metal layers. A landing pad provides a conductive path between the vias, the landing pad being formed with rectangular slots lying along part of the length of a chord across the pad. The slots are parallel to each other and lie in a horizontal plane parallel to the layers of the stack, defining a generally s-shaped conductive path between the vias. This pad structure reduces excess capacitance in the vicinity of the vias and allows better impedance matching to the standard 50 Ohm impedance of the traces. The PCB or package substrate may be used in a high frequency serial-deserializer. |
