发明名称
摘要 PROBLEM TO BE SOLVED: To prevent an impact to an electronic part and to shorten the cycle times of a sucking operation and a mounting operation as much as possible. SOLUTION: This control device lowers a sucking head, by which the electronic part is sucked, at a maximum speed by a first speed control unit. When the control device receives the output of a position detection sensor for detecting that the sucking head arrives at a position directly before a substrate, it switches the control of the sucking head to an touching control by a second speed control unit to change a lowering speed to a minimum speed to lower the sucking head at very slow speeds until the sucking head touches the substrate. When the occurrence of a setting touching pressure is detected by the pressure of a load cell, the device performs a pressing control of pressing the sucking head on the substrate to a target pressure as follows: the lowering speed is once increased to a setting middle speed and then is gradually lowered according to a change in the pressure difference between the target pressure and the detected pressing pressure.
申请公布号 JP4338860(B2) 申请公布日期 2009.10.07
申请号 JP20000013480 申请日期 2000.01.21
申请人 发明人
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
主权项
地址
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